Dahua 256GB NVMe M.2 PCLe Gen3 X 4 Solid State Drive DHI-SSD-C900N256G

Dahua 256GB NVMe M.2 PCLe Gen3 X 4 Solid State Drive DHI-SSD-C900N256G

0.000 KD
Sale price  0.000 KD Regular price  0.000 KD
Skip to product information
Dahua 256GB NVMe M.2 PCLe Gen3 X 4 Solid State Drive DHI-SSD-C900N256G

Dahua 256GB NVMe M.2 PCLe Gen3 X 4 Solid State Drive DHI-SSD-C900N256G

0.000 KD
Sale price  0.000 KD Regular price  0.000 KD

Installation Charges - 2 KWD Per Piece

Please Note :

  • Subject to Availability

  • Delivery Period Approximately: 10-15 Days

  • Payment Terms: 100% Advance 

Experience lightning-fast transfer speeds with the Dahua 256GB NVMe M.2 PCLe Gen3 X 4 Solid State Drive DHI-SSD-C900N256G. With a capacity of 256GB, this SSD is perfect for storing large files and running demanding programs. Its compact size makes it easy to install in a wide range of devices, while its PCIe Gen3 X 4 interface ensures optimal performance. Upgrade your storage solution today and see the difference for yourself.

Specifications

Model
  • DHI-SSD-C900N256G
Capacity
  • 256 GB
Form Factor
  • M.2 2280
Port
  • PCIe Gen 3.0 × 4
Net Weight
  • Max. 8 g (0.02 lb)
Product Dimensions
  • 80.00 mm × 22.00 mm × 2.25 mm (3.15" × 0.87" × 0.09")
Packaging Dimensions
  • 130 mm × 104 mm × 17 mm (5.12" × 4.09" × 0.67")
Memory Component
  • 3D NAND
Power Consumption2
  • 2950 mW (max) 528 mW (idle)
S.M.A.R.T
  • Yes
TRIM
  • Yes
Garbage Collection
  • Yes
Sequential Read2
  • Up to 1050 MB/s
4K Random Read2
  • Up to 88300
4K Random Write2
  • Up to 95400
MTBF
  • 1,500,000 hours
Operating Temperature
  • 0 °C to +70 °C (+32 °F to +158 °F)
Storage Temperature
  • –40 °C to +95 °C (–49 °F to +203 °F)
Operating Humidity
  • 5%–95% (non-condensing)
Vibration Resistance
  • 10-200Hz, 0.5 G
Shock Resistance
  • 1500G&0.5 ms (half sine wave)
TBW
  • 128 TB
Base Warranty
  • 1 Year
Additional Info
  • Supports PCIe3.0x4 and NVMe 1.3 protocol,Supports LDPC ECC to enhance data reliability,View information through S.M.A.R.T,Adopts high-quality 3D NAND wafer level chip and with 4K LDPC technology, the program-erase cycle is effectively improved to extend service time,Supports TRIM to improve read/write performance and speed,Low power consumption management

You may also like